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Home > Manufacturing > Subassemblies and Instruments > Semiconductors
HB LED & LED Packaging 2009
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| Published Date:
October 2009
Published By:
Yole Developpement
Page Count:
250
Order Code:
R393-111
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LED market analysis report with detailed descriptions of
process, equipment and materials for LED assembly
The market is a high-growth
field in the semiconductor
industry. The supply chain is
filled with various players from
LED die manufacturers (Epistar,
Forepi,…), to LED assembly
suppliers (Harvatek, Citizen,
Liteon, Samsung,….) to fully
integrated players (Lumileds,
Osram, Toyoda Gosei…).
In the wide range of LED
packaging solutions, this report
describes the existing packaging
process flow, materials and
equipment and the main
evolution in the coming years.
LED devices have been split in
2 categories:
- Regular LED
- High Brightness, Ultra High Brightness LED
The main processes are presented
for both categories:
- Dicing
- Die bonding
- Electrical interconnect
- Thermal management
- Encapsulation
The report highlights the main
technical challenges, current
solutions and future trends.
This report also includes market
analysis on equipment, materials
and services.
KEY FEATURES OF THE REPORT
- Detailed process flow of LED packaging (dicing
step, electrical interconnect, substrates,….)
- Market trends and figures for linked material
and equipment (in million $, in number of
units, ASP,…..)
- Key drivers for each technology & material
in use
- Supply chain analysis: who is doing what?
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