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Home > Industrial Markets > Advanced Materials > Resins
Resins in Electronic Equipment Enclosures
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| Published Date:
May 1999
Published By:
BCC Research
Page Count:
150
Order Code:
R2-291
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| Thinwalling and downsizing are the major drivers in the electronic enclosure market, which comprises computer/business equipment and consumer electronics. High impact polystyrene (HIPS), polycarbonates, ABS, PVC, and alloys/blends led by PC/ABS and PPO/HIPS are the most important resins used in these applications. This BCC report will estimate and forecast usage in these applications taking into consideration the explosive growth of portable electronic products, EMI shielding and challenges confronting the industry in terms of technologies, marketing and shortened product life cycles. From BCC.
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