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Home > Communications > Wireless > Components/Equipment
Strategic Analysis of the World Handset Radio Frequency (RF) Semiconductor Markets
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Persistent Demand for Compact Devices and Modular Solutions Challenges RF Suppliers to Deliver High-performing Cost-competitive Products
With the continuing demand for compact handsets with rich features at lower costs, radio frequency (RF) semiconductor manufacturers are facing a quandary. They are compelled to design, develop, and deliver high-performance devices that meet the requirements specified by handset manufacturers. They also have to keep pace with the shortened design cycles of handsets. Moreover, influenced by service providers’ desire for offering sophisticated services to consumers, OEMs are required to include the necessary hardware to support the various functionalities in their handsets. This has resulted in a transition toward modular RF solutions in place of discrete components, as the higher levels of integration helps in containing space and cost. To provide the desired solution, semiconductor suppliers need to adopt sophisticated technology and differentiate their products by incorporating additional functionalities. Simultaneously, they have to keep costs under control, as the market is highly competitive and the price-performance ratio can be a key differentiator.
This Frost & Sullivan strategic analysis provides an overview of the World handset RF semiconductor market. The market has been segmented into RF switch, filters (RF filters, IF filters, duplexers), power amplifier, and transceiver. It also discusses the market drivers and restraints as well as industry challenges, and provides recommendations to overcome them. The research enables companies to align their positioning strategies to benefit from the changing markets and obtain maximum return on investment.
Integration Drives Market Growth
Incremental integration is the buzzword in the handset RF semiconductor market with the demand for reduced form factor and additional features in a handset. Component manufacturers are under pressure to minimize the size of components and hence, the board space allotted for the RF section. "This calls for high levels of integration with the discretes and passives being progressively integrated into chips and multichip compact modules," says the analyst of this research. "This increasing drive toward integration results in modular or turn-key solutions and aids in strengthening the revenues for the RF-integrated circuits (ICs)."
Advances in process technologies and architectures drive such extensive integration. They enable handset RF semiconductor manufacturers to shrink their products dramatically even while including attractive applications and functionalities. Semiconductor suppliers have to provide highly integrated modular solutions with simplified designs at competitive prices. These solutions should also easily interface with existing and emerging baseband technologies to help suppliers capitalize on the immense market opportunities.
Multimode/Multiband Handsets Create Greater Opportunities for RF Semiconductors
"The swelling number of wireless standards coupled with the co-existence of many standards in any region necessitates multimode and multiband handsets that can cater to customers across different frequencies and bands," notes the analyst. "With the greater number of multimode/multiband handsets, there is a corresponding hike in the number of RF components that go into a handset." For example, additional filters have to be added in the front-end to serve multiple frequencies. It will ultimately increase the dollar value of RF semiconductors.
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