World WLAN and AGPS Chipsets Markets: Industry Research Report

World WLAN and AGPS Chipsets Markets

Published Date: June 2006

Published By: Frost & Sullivan

Order Code: R1-4978

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Description

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Research Overview

This Frost & Sullivan research service titled World WLAN and A-GPS Chipsets Market provides an overview of the drivers, restraints, and trends influencing the WLAN and A-GPS chipsets market. In addition to market and technology trends analysis by application and geographic regions for both markets, the study also offers an assessment of the competitive scenario and market shares of major competitors.

Technologies

The following technologies are covered in this research:

WLAN chipsets
A-GPS chipsets

Market Overview

WLAN and A-GPS to Make a Significant Impact in New Markets

Wireless local area network (WLAN) and assisted global positioning system (A-GPS) chipsets are both expanding their reach beyond traditional areas of interest. WLAN technology for instance is witnessing a transition from the retail and mobile PC/laptop segment to the burgeoning consumer electronics and mobile market. "With enterprises already enjoying the mobility and seamless connectivity offered by WLAN, the proliferation of hotspots and the promise of converged data, voice, and video service technology is going to open up new growth opportunities for WLAN in the consumer electronics and cellular devices market," observes the analyst of this research service. In order to effectively tap into this market semiconductor vendors will need to provide high performance wireless solutions that are small in size, cost-effective, and power efficient.

A-GPS on the other hand is moving beyond defense-oriented applications and is gradually penetrating the mass market. Faster time-to-first-fix (TTFF), reduction in power consumption, and the ability to track satellites under weak signal conditions are proving to be the major drivers fuelling the growth of the A-GPS chipset market. Emergency services such as E911 and location-based services (LBS) are expected to benefit tremendously from such improvements in A-GPS functionalities.

Integration into a Single Package Solution Proves Challenging for Semiconductor Vendors

As WLAN and GPS penetrate more number of devices for various applications, integration of the chipset into a single package solution will be a major challenge. In order to remain competitive in the WLAN and A-GPS chipset market, semiconductor vendors need to provide high performance, cost-effective single package solutions that consume less power. In the case of WLAN, integration based on the performance of the radio frequency (RF) is expected to be a key issue. "The RF performance is a key factor for improving range, reliability, throughput, connectivity, and minimizing interference," explains the analyst. "As WLAN penetrates embedded applications such as cellular and consumer electronic devices, integrating all the functionalities onto a single silicon or chip based on the performance could prove highly challenging."

In order to overcome integration issues for A-GPS chipsets, semiconductor vendors are using different process technologies to achieve a single package solution. While some opt for a Si-Ge RF front-end process to obtain enhanced performance, others are trying a complementary metal oxide semiconductor (CMOS) based front-end process.

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