This IDC study includes market forecast data and analysis on a worldwide basis for the mobile phone semiconductor market for 2008 through 2012. This document provides segmentation by various air interface standards in 2G, 2.5G, 3G, and 3.5G technologies; major semiconductor device type; and geographic region. It also provides comprehensive data on semiconductor BOM costs by air interface standard and component subsystem. Further detail is provided by component for each air interface. Key forecast assumptions are identified, and their potential impact on the mobile phone semiconductor market is discussed. A comparison of the current forecast to the prior forecast is also noted.

"Connectivity and other multimedia related semiconductor content such as NAND flash memory will continue to be the primary drivers in this market as mobile phone functionality continues to move beyond voice to rich multimedia and services." - Flint Pulskamp, program manager, Wireless Semiconductors