Industry Research Reports and Market Analysis at MindBranch.com

Silicon Wafer Fabrication Materials and Suppliers, 2001-2006

Published By: Kline & Company, Inc.
September 2002
R379-0093
Print Copy (Up to 3 Copies)   $4,900.00
Online Access (Corporate License)   $6,400.00
Description

A syndicated analysis designed to explore what materials are used in wafer fabrication, to assess market growth, and to gauge supplier competitiveness.

Covering four major processes:

  • Photolithography
  • Chemical-mechanical planarization
  • Dielectric deposition
  • Metals deposition

    With detail on a total of 22 subsegments of these major market categories

    SILICON WAFER FABRICATION MATERIALS AND SUPPLIERS, 2001-2006 is designed to help strategic planners involved in materials supply and process tool development to better understand the timing and impact of the inevitable change in semiconductor fabrication practices. Specifically, the report provides subscribers with the following benefits:

    • An accurate five-year prediction of the markets for critical consumables and equipment used in silicon-wafer fabrication
    • Detailed descriptions of these consumables
    • Industry concentration analysis, including supplier share

    REPORT FINDINGS

    Market growth. Despite a general slowdown in the electronics industry and sharp cutbacks in the sale of wafer fabrication tools, the market for consumables in silicon-based semiconductor manufacturing registered over $3.8 billion in 2001. This was certainly lower than the year earlier—anecdotal evidence suggests about 20% lower— but the long term prospects are for 14% per year overall growth. The market for 2002 is expected to be about the same as it was in 2001.

    Growth in market value and industry concentration are analyzed for 22 market segments, grouped into six major categories. The growth rates for the six categories are as follows:

    • Dielectric precursors: 23% per year, once expensive low-k dielectrics become common within a few years
    • Chemical-mechanical planarization (CMP): 18% per year, thanks to its wider use overall and the growth of copper processing
    • Photoresist and ancillaries: 15% per year as expensive 193-nm and 157-nm resists come into use
    • Cleaning chemicals: 12% per year, aided by demand for environmentally safe chamber cleaners and advanced post-etch removers for copper processing
    • Etchants: 7% per year, with dry etchants growing faster than wet varieties
    • Metal deposition precursors: 4% per year, a relatively slow rate cause by the substitution of cheaper copper plating baths for physical vapor deposition and chemical vapor deposition precursors

    Industry concentration. The study rates 22 market segments in terms of industry concentration. Kline assessed the market share of the leading supplier in each segment, the number of suppliers that accounted for 80% of market value, and other factors in making these determinations. Overall, the study finds that manufacturers of semiconductor precursor materials are "moderately concentrated," but with wide variations between major industry groupings.

    • Table of Contents
    SILICON WAFER FABRICATION MATERIALS AND SUPPLIERS, 2001-2006

    TABLE OF CONTENTS

    2. INTRODUCTION

    3. APPLICATIONS
    Figure 3-1 TOP SUPPLIERS OF ASICs, 2001
    Figure 3-2 TOP SUPPLIERS OF DSPs, 2001
    Figure 3-3 TOP SUPPLIERS OF MICROPROCESSORS, 2001
    Figure 3-4 TOP SUPPLIERS OF FLASH MEMORY, 2001
    Figure 3-5 TOP SUPPLIERS OF DRAM, 2001
    Figure 3-6 TOP SUPPLIERS OF SRAM, 2001
    4. CMP CONSUMABLES
    >Table 4-1 USAGE RATES FOR CMP CONSUMABLES
    Figure 4-1 CMP MARKET VALUE, 2000 TO 2006
    Figure 4-2 SLURRY USAGE IN CMP APPLICATIONS, 2000
    Figure 4-3 CONSUMPTION OF POLISHING PADS IN CMP, 2000
    Figure 4-4 OVERALL PAD CONDITIONER VOLUME AND VALUE, 2000
    Figure 4-5 OVERALL MARKET FOR CMP BRUSHES, BY MEDIA PLANARIZED, 2000
    Figure 4-6 OVERALL CMP FILTER VOLUME AND VALUE, 2000
    Figure 4-7 NON-SLURRY SOLUTIONS MARKET IN CMP, 2000
    5. DIELECTRIC MATERIALS
    Table 5-1 CLASSIFICATIONS OF DIELECTRICS AND ANCILLARY MATERIALS
    Figure 5-1 OVERALL GROWTH IN DIELECTRICS CONSUMABLES, 2000 TO 2006
    Table 5-2 PROS AND CONS OF LOW K ALTERNATIVES
    Figure 5-2 SPIN-ON VERSUS CVD TREND ANALYSIS
    6. PHOTORESIST
    Figure 6-1 CONSUMPTION OF PHOTORESISTS AND ANCILLARIES, 2001 TO 2006
    7. ETCHING COMPOUNDS
    Table 7-1 ETCH GASES USED IN SEMICONDUCTOR FABRICATION
    Table 7-2 OUTLOOK FOR ETCHANTS, 2001 TO 2006
    8. CLEANING COMPOUNDS
    Figure 8-1 PURITY TRENDS FOR TRADITIONAL CLEANING AND DRYING CHEMICALS
    9. METALLIZATION PRECURSOR MATERIALS
    Table 9-1 MATERIALS USED IN SEMICONDUCTOR METAL DEPOSITION
    Table 9-2 PRIMARY AND ANCILLARY METALLIZATION PRECURSORS, BY DEPOSITION PROCESS
    Table 9-3 COMMON INORGANIC CVD PRECURSORS
    Table 9-4 COMMON ORGANIC CVD PRECURSORS
    10. SUPPLIERS
    Table 10-1 TOP SUPPLIERS OF SEMICONDUCTOR PRECURSOR MATERIALS, 2001
    Table 10-2 SUPPLIERS TO THE SEMICONDUCTOR PRECURSOR MATERIALS MARKET, 2001
    Table 10-3 MARKET CONCENTRATION ANALYSIS
    Order Form
           * Please reference product number R379-0093 when ordering or inquiring.
    PUBLICATION:   Silicon Wafer Fabrication Materials and Suppliers, 2001-2006
    QTY. FORMAT PRICE TOTAL
      Print Copy (Up to 3 Copies)$4,900.00   
      Online Access (Corporate License)$6,400.00   
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