Worldwide Switch Fabric/Backplane Semiconductor 2003 Vendor Analysis: Industry Report

Worldwide Switch Fabric/Backplane Semiconductor 2003 Vendor Analysis

Product Type: Market Research Report
Published by: IDC
Published: August 2004
Product Code: R104-16976

Description

This IDC study examines switch fabric/backplane semiconductor vendors.

"With limited R&D resources and rising nonrecurring engineering charges for advanced ASICs, many OEMs are now opting for merchant ASSP approach to satisfy more advanced switching/backplane requirements." ? Sean Lavey, program manager, Semiconductors

Table of Contents

Table of Contents
IDC Opinion
In This Study
Scope
Methodology
Situation Overview
Table: Worldwide Switch Fabric/Backplane ASSP Revenue by Vendor, 2002 and 2003
Table: Worldwide Switch Fabric/Backplane ASIC and PLD Revenue by Vendor, 2002 and 2003
Figure: Worldwide Switch Fabric/Backplane ASSP Revenue Share by Vendor, 2002 and 2003
Figure: Worldwide Switch Fabric/Backplane ASIC and PLD Revenue Share by Vendor, 2002 and 2003
Future Outlook
Forecast Trends and Vendor Review
Table: Multiprotocol Switch Fabric Product Matrix
ATCA Gaining Further OEM Commitments
Figure: 16-Slot ATCA Chassis Diagram
Essential Guidance
Learn More
Related Research
Definitions
Synopsis

Ordering and More Information

Price and Delivery Options

MindBranch has been the leading provider of industry and investment research from more than 550 independent research firms since 1992. With over 90,000 market research reports, MindBranch is your trusted source of competitive business intelligence.