Printing Technology For Flexible Substrates

Introduction

I. Material technology section

Chapter 1: Flexible substrates

1.1 Requirements and issues related to flexible substrates

1.2 Materials comprising flexible substrates

1.3 Flexible substrate gas barrier technologies

1.4 Technologies for forming devices and interconnects on flexible substrates

1.5 Efforts by corporations and research institutions

Chapter 2: Organic Transistor Materials

2.1 Principle and structure of organic transistors

2.2 Requirements and issues related to organic semiconductors for transistors

2.3 Types and characteristics of organic transistor materials

2.4 Solubility of organic semiconductor materials

2.5 Technology for controlling the molecular aggregation state

2.6 Organic transistors as active matrix-driven devices

2.7 Efforts of corporations and research institutions

2.8 Future outlook

Chapter 3: Electrode and Interconnect Materials

3.1 Types and characteristics of interconnect formation technologies

3.2 Materials used for forming electrodes and interconnects

II. Processing Technologies

Chapter 1: Patterning Technologies

1.1 Spincoating method

1.2 Inkjet method

1.3 Screenprinting method

1.4 Gravure printing

1.5 Flexo printing

1.6 Nanoimprinting technology

1.7 Dip-pen nanolithography (DPN)

1.8 Self-assembling technologies

Chapter 2: Wiring Formation/Bonding Technology

2.1 Wiring formation using metal nanopaste

2.2 Interlayer conduction

2.3 Use of metal nanopaste in semiconductor bonding

2.4 Application of metal nanopaste to SIP (System in Package)

Chapter 3: Transfer technology

3.1 Background on the need for transfer technology

3.2 Methods of producing plastic substrate TFTs

3.3 Transfer of TFT circuits to a plastic substrate

Chapter 4: Efforts by Corporations and Research Institutes

4.1 Seiko Epson

4.2 ULVAC Corporation/Harima Chemical

4.3 Dai Nippon Printing

4.4 Toppan Printing

4.5 National Institute of Advanced Industrial Science and Technology (AIST)

4.6 Cluster Technology (CTC)

4.7 Technology Research Association for Advanced Display Materials (TRADIM)

4.8 Fuji Electric

III. Application Chapter

Chapter 1: Flexible Printed Circuit Boards

1.1 FPC manufacturing methods

1.2 Copper-clad laminates

1.3 Membrane circuit boards

1.4 Multi-layer FPC

Chapter 2: Displays (1), Liquid Crystal Displays (LCDs)

2.1 Principles of liquid crystal displays

2.2 LCD drive methods

2.3 LCD structure and structural materials

2.4 Method for LCD formation on flexible substrates

2.5 Examples of plastic substrate LCDs under development

Chapter 3: Displays (2): Organic Electroluminescent Displays

3.1 Operational principles of OLEDs

3.2 Basic construction of organic electroluminescent displays

3.3 Materials used in organic electroluminescent displays

3.4 Forming organic electroluminescent elements on a flexible substrate

3.5 Recently developed organic electroluminescent displays

3.6 Efforts of corporations and research institutes

3.7 What the future holds

Chapter 4: Displays (3): Field emission displays (FEDs)

4.1 Principles of FEDs

4.2 CNT-FED fabrication

Chapter 5: Electronic Paper

5.1 Concept of electronic paper

5.2 Electronic paper implementation modes

5.3 Candidate technologies for electronic paper

5.4 Technical trends and future outlook of electronic paper

Chapter 6: Solar Cells

6.1 Types of solar cells

6.2 Flexible solar cells

6.3 Principle behind the dye-sensitized solar cell

6.4 Materials used in dye-sensitized solar cells

6.5 Semiconductor electrode film formation

6.6 Current status of solar cells and future outlook

Chapter 7: Batteries

7.1 Sheet manganese batteries

7.2 Structure and characteristics of lithium ion secondary battery

7.3 Expanding applications for lithium ion secondary batteries

Chapter 8: IC card/tag structures

8.1 IC card/tag structures

8.2 IC card/tag structure

8.3 Processing of IC cards/tags into products

8.4 Current status of IC cards/tags and future outlook

Chapter 9: Flexible Sensors

9.1 Structure of the flexible, large-area pressure sensor

9.2 Fabrication of the flexible, large-area pressure sensor

9.3 Future outlook