The Global Outlook for Resist, Etch, and Cleaning Materials for Sub-0.25-Micron Semiconductors 2001-2006

THE GLOBAL OUTLOOK FOR RESIST, ETCH, AND CLEANING MATERIALS FOR SUB O.25µ SEMICONDUCTORS, 2000-2005 is designed to help strategic planners involved in materials supply and process tool development to better understand the timing and impact of the inevitable change in semiconductor fabrication practices. Specifically, the report will provide subscribers with the following benefits:

• An accurate five-year prediction of the markets for consumables and equipment used in photolithography
• Profiles of materials and equipment suppliers
• An assessment of competing technologies
• Onsite consultation with Kline industry experts

With the industry currently working at the 180-nm design node, 248-nm lithography is nearing its limit. Applications to 150 nm may be possible; in fact, they might be necessary because of delays in the development of 193-nm lithography, using ArF light sources. This technology is expected to last a couple of generations, to 100 nm, after which a new set of resist systems based on deep ultraviolet (DUV, less than 100 nm wavelength) should kick in.

With each generation come new challenges for chemicals and materials. Furthermore, the scale of integration, with increasing aspect ratios, places increased performance demands on all the consumables used in lithography, from primers right through rinses. Add to this the problem of ensuring compatibility with copper and low-k layers, and the importance of developing resist, etch, and cleaning technology in lockstep with these others becomes obvious.

THE GLOBAL OUTLOOK FOR RESIST, ETCH, AND CLEANING PRODUCTS FOR SUB-0.25-MICRON SEMICONDUCTORS, 2001-2006

FOREWORD

TABLE OF CONTENTS

2. INTRODUCTION

3. TECHNOLOGY OVERVIEW

Figure 3-1 INTEGRATION OF RESIST, ETCH, AND CLEANING PROCESSES

Figure 3-2 THE PHOTORESIST EXPOSURE SPECTRUM

Figure 3-3 EXPOSURE TECHNOLOGY ROADMAP, 2001

Figure 3-4 FLOW CHART FOR PHOTORESIST PROCESS

Figure 3-5 SPIN COATING PROCESS

Figure 3-6 INCREASING PHOTORESIST DISPENSE EFFICIENCY

Figure 3-7 NEGATIVE AND POSITIVE PHOTORESIST PROCESSING SCHEMATIC

Figure 3-8 ADVANCED PHOTORESIST PROCESSING SCHEMATIC

Figure 3-9 PHOTORESIST ANCILLARY PRODUCTS

Figure 3-10 INTERNATIONAL SEMATECH NGL TASK FORCE SELECTIONS

Figure 3-11 MECHANISMS OF ETCHING

Table 3-1 TECHNOLOGY MILESTONES IN SEMICONDUCTOR CLEANING

Figure 3-12 PARTICLE REMOVAL MECHANISMS

Figure 3-13 CLEANING ROADMAP

4. APPLICATIONS

Figure 4-1 GROWTH IN LITHOGRAPHY OPERATIONS FOR NON-INTERCONNECT INTEGRATED CIRCUITS, 2001 TO 2006

Table 4-1 PHOTOLITHOGRAPHIC OPERATIONS BY LAYER TYPE, 2001 TO 2006

Table 4-2 COUNT OF IMAGING OPERATIONS IN ASICs, 2001 TO 2006

Table 4-3 PHOTOLITHOGRAPHY OPERATIONS IN ASICs BY LAYER TYPE, 2001 TO 2006

Figure 4-2 TOP SUPPLIERS OF ASICs, 2001

Table 4-4 PHOTOLITHOGRAPHY OPERATIONS IN DSPs BY LAYER TYPE, 2001 TO 2006

Figure 4-3 TOP SUPPLIERS OF DSPs, 2001

Table 4-5 PHOTOLITHOGRAPHY OPERATIONS IN MICROPROCESSORS BY LAYER TYPE, 2001 TO 2006

Figure 4-4 TOP SUPPLIERS OF MICROPROCESSORS, 2001

Table 4-6 COUNT OF LITHOGRAPHY OPERATIONS IN MEMORY DEVICES, 2001 TO 2006

Table 4-7 PHOTOLITHOGRAPHY OPERATIONS IN MEMORY BY LAYER TYPE, 2001 TO 2006

Figure 4-5 TOP SUPPLIERS OF FLASH MEMORY, 2001

Figure 4-6 TOP SUPPLIERS OF DRAM, 2001

Figure 4-7 TOP SUPPLIERS OF SRAM, 2001

5. PHOTORESIST

Figure 5-1 DEVELOPMENT AND INVESTMENT REQUIREMENTS FOR CHEMICALLY AMPLIFIED PHOTORESIST

Table 5-1 COMMON G-LINE AND I-LINE SEMICONDUCTOR PHOTORESISTS

Table 5-2 COMMON CHEMICALLY AMPLIFIED DUV SEMICONDUCTOR RESISTS

Figure 5-2 248-NM DUV MATRIX RESINS

Figure 5-3 248-NM DUV RESIST PROTECTING GROUPS

Figure 5-4 248-NM DUV RESIST PHOTOACTIVE GENERATORS

Figure 5-5 METHACRYLATE RESINS

Figure 5-6 CYCLIC OLEFIN RESINS

Figure 5-7 COMA RESINS

Table 5-3 193-NM PHOTOACTIVE GENERATORS

Table 5-4 COMMON ANTIREFLECTIVE COATINGS

Table 5-5 COMMON DEVELOPERS

Table 5-6 COMMON EDGE BEAD REMOVERS

Table 5-7 SEMICONDUCTOR PHOTORESIST MARKET, 2001

Figure 5-8 REGIONAL DISTRIBUTION OF SEMICONDUCTOR PHOTORESIST SALES, 2001

Figure 5-9 GLOBAL SEMICONDUCTOR PHOTORESIST MARKET SHARE ESTIMATES, 2001

Table 5-8 OUTLOOK FOR PHOTORESISTS AND ANCILLARIES BY VOLUME, 2001 TO 2006

Figure 5-10 VOLUME OUTLOOK FOR PHOTORESISTS BY RESIST TYPE, 2001 TO 2006

Table 5-9 OUTLOOK FOR PHOTORESISTS AND ANCILLARIES BY VALUE, 2001 TO 2006

Figure 5-11 VALUE OUTLOOK FOR PHOTORESISTS BY RESIST TYPE, 2001 TO 2006

6. ETCHING COMPOUNDS

Table 6-1 ETCH GASES USED IN SEMICONDUCTOR FABRICATION

Table 6-2 COMMON SILICON FILM CHEMICAL ETCHANTS

Table 6-3 COMMON DIELECTRIC FILM CHEMICAL ETCHANTS

Table 6-4 COMMON METAL FILM CHEMICAL ETCHANTS

Table 6-5 THIN-FILM GAS ETCHANT MARKET, 2001

Figure 6-1 REGIONAL DISTRIBUTION OF SALES FOR THIN-FILM GAS ETCHANTS, 2001

Figure 6-2 REGIONAL DISTRIBUTION OF SALES FOR WET CHEMICAL ETCHANT MIXTURES AND ACIDS, 2001

Figure 6-3 SUPPLIERS OF THIN-FILM GAS ETCHANTS, 2001

Figure 6-4 SUPPLIERS OF WET CHEMICAL ETCH MIXTURES AND ACIDS, 2001

Table 6-6 OUTLOOK FOR ETCHANTS, 2001 TO 2006

7. CLEANING COMPOUNDS

Table 7-1 COMMON WAFER CLEANING AND DRYING COMMERCIAL PRODUCTS

Table 7-2 COMMON STRIPPER AND REMOVAL COMMERCIAL PRODUCTS

Figure 7-1 PURITY TRENDS FOR TRADITIONAL CLEANING AND DRYING CHEMICALS

Table 7-3 GLOBAL CONSUMPTION OF CLEANING CHEMICALS, 2001

Figure 7-2 CONSUMPTION OF WAFER CLEANING AND DRYING CHEMICALS BY REGION, 2001

Figure 7-3 CONSUMPTION OF STRIPPERS AND REMOVERS BY REGION, 2001

Figure 7-4 CONSUMPTION OF CHAMBER CLEANING CHEMICALS BY REGION, 2001

Figure 7-5 SUPPLIERS OF WAFER CLEANING AND DRYING CHEMICALS, 2001

Figure 7-6 SUPPLIERS OF STRIPPING AND REMOVAL MATERIALS, 2001

Figure 7-7 SUPPLIERS OF CHAMBER CLEANING GASES, 2001

Table 7-4 OUTLOOK FOR GLOBAL CONSUMPTION OF CLEANING CHEMICALS, WEIGHT/VOLUME BASIS, 2001 TO 2006

Table 7-5 OUTLOOK FOR GLOBAL CONSUMPTION OF CLEANING CHEMICALS, VALUE BASIS, 2001 TO 2006

8. SUPPLIERS

Figure 8-1 LEADING SUPPLIERS OF CLEANING CHEMICALS, 2001

Table 8-1 SHARES OF RESIST, ETCH, AND CLEANING COMPOUNDS SOLD TO THE SEMICONDUCTOR INDUSTRY, 2001 $ Million

Figure 8-2 RESIST, ETCH, AND CLEANING COMPOUNDS OF AIR PRODUCTS AND CHEMICALS

Table 8-2 ELECTRONIC PRODUCTS PORTFOLIO OF AIR PRODUCTS AND CHEMICALS

Figure 8-3 RESIST, ETCH, AND CLEANING COMPOUNDS OF TOKYO OHKA KOGYO

Table 8-3 ELECTRONIC PRODUCTS PORTFOLIO OF TOKYO OHKA KOGYO

Figure 8-4 RESIST, ETCH, AND CLEANING COMPOUNDS OF ASHLAND SPECIALTY CHEMICAL

Table 8-4 ELECTRONIC PRODUCTS PORTFOLIO OF ASHLAND SPECIALTY CHEMICAL

Figure 8-5 RESIST, ETCH, AND CLEANING COMPOUNDS OF SHIPLEY

Table 8-5 ELECTRONIC PRODUCTS PORTFOLIO OF SHIPLEY

Figure 8-6 RESIST, ETCH, AND CLEANING COMPOUNDS OF JSR CORPORATION

Table 8-6 ELECTRONIC PRODUCTS PORTFOLIO OF JSR

Figure 8-7 RESIST, ETCH, AND CLEANING COMPOUNDS OF KANTO KAGAKU

Table 8-7 ELECTRONIC PRODUCTS PORTFOLIO OF KANTO KAGAKU

Figure 8-8 RESIST, ETCH, AND CLEANING COMPOUNDS OF SUMITOMO

Table 8-8 ELECTRONIC PRODUCTS PORTFOLIO OF SUMITOMO

Figure 8-9 RESIST, ETCH, AND CLEANING COMPOUNDS SOLD BY ARCH CHEMICALS

Table 8-9 ELECTRONIC PRODUCTS PORTFOLIO OF ARCH CHEMICALS

Figure 8-10 RESIST, ETCH, AND CLEANING COMPOUNDS OF CLARIANT

Table 8-10 ELECTRONIC PRODUCTS PORTFOLIO OF CLARIANT

Table 8-11 ELECTRONIC PRODUCTS PORTFOLIO OF AIR LIQUIDE

Table 8-12 ELECTRONIC PRODUCTS PORTFOLIO OF ATMI

Table 8-13 ELECTRONIC PRODUCTS PORTFOLIO OF BOC

Table 8-14 ELECTRONIC PRODUCTS PORTFOLIO OF BREWER SCIENCE

Table 8-15 ELECTRONIC PRODUCTS PORTFOLIO OF DONGJIN

Table 8-16 ELECTRONIC PRODUCTS PORTFOLIO OF DUPONT

Table 8-17 ELECTRONIC PRODUCTS PORTFOLIO OF EKC

Table 8-18 ELECTRONIC PRODUCTS PORTFOLIO OF GENERAL CHEMICAL

Table 8-19 ELECTRONIC PRODUCTS PORTFOLIO OF J.T. BAKER

Table 8-20 ELECTRONIC PRODUCTS PORTFOLIO OF MERCK ELECTRONIC MATERIALS

Table 8-21 ELECTRONIC PRODUCTS PORTFOLIO OF MITSUBISHI GAS