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The Worldwide Motherboard Application IC Market, 4Q 2007Product Type: Market Research ReportPublished by: Market Intelligence Center Published: December 2007 Product Code: R760-280 Description Presents forecast and recent quarter review of worldwide motherboard shipment volume. Also provides recent quarter review of worldwide motherboard shipment volume by CPU connector type and by CPU supplier. Includes worldwide motherboard shipment volume by chipset supplier and by chipset type.Table of Contents
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