Product Type: Market Research Report
Published by: Market Intelligence & Consulting Institute
Published: February 2009
Product Code: R760-515Description CCMs are developing towards smaller sizes and lower costs. However, traditional CCM assembly methods are restricted by materials and technology, and there are bottlenecks in terms of product cost control. As a result, wafer-level camera modules have emerged. Wafer-level camera modules make use of semiconductor production processes to manufacture optical components, and are integrated with the image sensor. This process can enable companies to achieve their goals of making modules smaller and lowering prices. Large-scale production and low prices will threaten existing camera module makers, and could also lead to changes in the CCM industry supply chain. However, a challenge for wafer-level modules is yield rate, which will have to increase significantly before they will have a significant impact.Table of Contents - 1. Small Size and Low Cost Are Advantages of Wafer-level Camera Modules
- 2. Changes in the CCM Industry Supply Chain
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- MIC Perspective
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- Appendix
- List of Topics
- Analysis of advantages and disadvantages of different CCM assembly methods
- Emergence of wafer-level camera modules and their technological characteristics
- Impact of wafer-level camera modules on the existing CCM industry supply chain, including impact on different component suppliers
- Companies and organizations analyzed or mentioned in the report include: Aptina, Digital Optics, Eyesquad, FotoNation, Foxonn, Fujinon, Heptagon, Kantatsu, Kolen, Konica Minolta, Largan, MagnaChip, Mitsumi, OV, Panasonic, Samsung, Samsung Tech, SEMCO, Sharp, Shellcase, Siliconfile, Sony, ST Micro, Tessera, Toshiba, VisEra Technologies, VistaPoint, Xintec
- List of Tables
- Table 1 Key Players in the Worldwide CCM Supply Chain
- List of Figures
- Figure 1 The Evolving CCM Supply Chain
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