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The Worldwide Motherboard Application IC Market, 3Q 2009

Product Type: Market Research Report
Published by: Market Intelligence & Consulting Institute
Published: August 2009
Product Code: R760-625
Description
This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers.
Table of Contents
List of Tables

1. Worldwide Motherboard Shipment Volume, 1Q 2007 - 2Q 2010

2. Worldwide Motherboard Shipment Volume by CPU Supplier, 1Q 2007 - 2Q 2009

3. Worldwide Motherboard Shipment Share by CPU Supplier, 1Q 2007 - 2Q 2009

4. Worldwide Motherboard Shipment Volume by CPU Connector Type, 1Q 2007 - 2Q 2009

5. Worldwide Motherboard Shipment Share by CPU Connector Type, 1Q 2007 - 2Q 2009

6. Worldwide Motherboard Shipment Volume by Chipset Supplier, 1Q 2007 - 2Q 2009

7. Worldwide Motherboard Shipment Share by Chipset Supplier, 1Q 2007 - 2Q 2009

8. Worldwide Motherboard Shipment Volume by Chipset Type, 1Q 2007 - 2Q 2009

9. Worldwide Motherboard Shipment Share by Chipset Type, 1Q 2007 - 2Q 2009
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