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The AdvancedTCA Market Slowly Builds Momentum

Product Type: Market Research Report
Published by: In-Stat
Published: March 2005
Product Code: R97-1954
Description
Open Standards Chassis (OSCs) are nothing new. They have been around since the mid 1980s. Standards such as VMEbus and CompactPCI have met with varying levels of success over the years. However, now with the advent of the AdvancedTCA, there is a renewed sense of interest in the potential for using standardized chassis in more places. Part of that enthusiasm has spurred splintering standards such as the CompactTCA and the MicroTCA. Plus, IBM has taken a page from the PICMG playbook and is working on making its BladeCenter an open standard. When you combine all of these various OSCs together, we find that they currently garner about 1.5% of the overall CapEx equipment market. However, this penetration rate can, and will improve. By 2009, the overall market will be over $12 billion, between all the various forms of OSCs.

In addition, this strong growth will help generate the volumes needed to bring economies of scale to the AdvancedTCA market, allowing it to penetrate other industries, such as Military, Medical/Industrial, and finally the coveted Enterprise market. All of these other markets will help the AdvancedTCA surpass its communications only revenue by an additional 47%.

This report has forecasts for each of the major types of OSCs in the communications markets, plus an extended forecast for the AdvancedTCA in all of its potential market places.
Table of Contents

Table
of Contents




  • Executive Summary

  • Methodology &
    Definitions


  • Introduction


    • Technical Overview


    • Market Overview


    • Forecasts




  • Technical Overview


    • Network Equipment
      Building Standards (NEBS)


    • VMEbus


    • CompactPCI


      • CompactPCI Packet
        Switching Backplane


      • CompactPCI Serial
        Mesh Backplane




    • AdvancedTCA


      • Backplane Options


      • Advanced Mezzanine
        Cards


      • Rear Transition
        Modules




    • CompactTCA


    • MicroTCA


    • BladeCenter (IBM)



      • Fundamental Dimensions


      • Backplane Options


      • Strengths


      • Weaknesses




    • Which Chassis Will
      Win?




  • Market Overview


    • Market Drivers


      • OSCs and Merchant
        Networking Silicon


      • From a NEP’s
        Perspective


      • From a Service
        Provider’s Perspective


      • The Proprietary
        Disadvantage






  • OSC Forecast


List
of Tables








  • Table 1. Partial
    List of Topics Covered by the NEBS Criteria

  • Table 2. A
    Comparison of the Key Dimensions for PICMG 3.0 versus PICMG 2.0

  • Table 3. Aggregate
    Backplane Capacities for a Full Mesh AdvancedTCA Backplane

  • Table 4. Aggregate
    Backplane Capacities for a Dual Star AdvancedTCA Backplane

  • Table 5. Future
    Capacities for the AdvancedTCA Due to SerDes Improvements

  • Table 6. Key
    Dimensions for the BladeCenter Chassis

  • Table 7. Key
    Dimensions for a BladeCenter Board

  • Table 8. Hourly,
    Full-Duplex Data Consumption Rates for Popular Online Activities

  • Table 9. Standardized
    Chassis Revenue Forecast, 2004 – 2009 ($M)

  • Table 10. Standardized
    Chassis Revenue Forecast, 2004 – 2009 ($M)

  • Table 11. AdvancedTCA
    Revenues in Various Market Segments, 2004 – 2009 ($M)


List
of Figures



  • Figure 1. Revenue
    Forecast for the OSCs Market ($B)

  • Figure 2. Logical
    Depiction of the CompactPCI Packet Switch Backplane (PICMG 2.16)

  • Figure 3. Logical
    Depiction of the CompactPCI Serial Mesh Backplane (PICMG 2.20)

  • Figure 4. A Pictorial
    Comparison of the Key Differences between PICMG 3.0 and 2.0

  • Figure 5. Isometric
    Drawing of the AdvancedTCA (PICMG 3.0) with Key Dimensions

  • Figure 6. Logical
    Depiction of GigE Mesh Backplane for the AdvancedTCA

  • Figure 7. Logical
    Depiction of a Dual Star Switch Backplane for the AdvancedTCA

  • Figure 8. Physical
    and Logical Layout of a Backplane Connector for the AdvancedTCA

  • Figure 9. All of
    Zone 2 Connectors for the AdvancedTCA Backplane

  • Figure 10. Graphical
    Depiction of How the AMCs and RTMs Relate to the AdvancedTCA

  • Figure 11. How
    to Enhance Modularity of the AdvancedTCA with AMCs and RTMs

  • Figure 12. Front-Side
    Picture of IBM’s BladeCenter Chassis

  • Figure 13. Rear-View
    Picture of IBM’s BladeCenter Chassis

  • Figure 14. Logical
    Depiction of a Dual-Star Switch Backplane for the AdvancedTCA

  • Figure 15. An Example
    of How TBSs Can Reduce OpEx and Increase Revenues

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