The Sum of the Parts 2 - A listing of components used in Mobile Cellular/PCS Handsets

The cellular phone market continues on its roller-coaster ride, demand for handset components follows in-step. The intent of this report is to present a list of the most commonly used standard semiconductor components used in cellular/PCS handsets. The report contains components used in digital handsets, broken down by handset functional sub-section, which includes memory, processor, power management, rf, audio, baseband, display, DSPs, and SAW filters. Companies represented in the report include AMD, Agilent, Anadigics, Analog Devices, Celeritek, Conexant, Fairchild, Fujitsu, Hitachi, IDT, Infineon, Intel, LSI Logic, Maxim, Motorola, National Semiconductor, NEC, Oki, Philips, PrairieComm, Qualcomm, RF Microdevices, Samsung, ST Microelectronices, TI, Toshiba, and Zilog.

• Executive Summary
  
  


• Methodology
  
  


• Memory
  
  


• SAW (Surface Acoustic Wave) Filters
  
  


• Audio Processing
  
  


• Power Supply
  
  


• RF
  
  


• Display
  
  


• Chipsets
  
  


• MPU
  
  


• Baseband/DSP
  
  


• Other
  
  
  

List of Tables

• Table 1. Memory
  
  


• Table 2. SAW
  
  


• Table 3. Audio Processors
  
  


• Table 4. Power Management
  
  


• Table 5. RF
  
  


• Table 6. Display
  
  


• Table 7. Chipsets
  
  


• Table 8. MPU
  
  


• Table 9. BaseBand
  
  


• Table 10. DSP
  
  


• Table 11. Other
  
  


• Table 12. Other (Cont.)
  
  


• Table 13. Other (Cont.)
  
  


• Table 14. Other (Cont.)