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Home > Computers and Information Technology > Networking > Hardware
Award Winning Processors: Microprocessor Report Unveils the Best Processors of 2005
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| Published Date:
February 2006
Published By:
In-Stat
Page Count:
72
Order Code:
R97-2290
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- Introduction
- MPRs Best
PC Processor of 2005
- Dual-Core and
Mobile Processor Architectures Change the Playing Field
- MPRs Best
Server of 2005
- Choice Reflects
the Best-Balanced Processor
- AMD Changes
Its Strategy
- AMD Adds Seven
Years of Support to Selected Opterons.
- Shift in
Server Designs
- One More
Step in Server Equation
- On the Road
to Many-Core µPs
- Cores Proliferate
at Intels Spring 05 Developer Forum
- What Makes
a Dual-Core Processor?
- The Platforms
for the Dual Core
- Yonah and
Montecito Take Dual Core to Heart
- Many-Core
Processors in the Future
- AMDs Turion
64 Mobile Processor
- An AMD64 Processor
by Any Other Name
- How Does
Turion 64 Stack Up?
- Reading
Between the Lines
- Day at the Races
- AMD and Intel
Rush Dual-Core Introductions
- Is the
Market Ready?
- Expect
More Announcements Shortly
- Multicore Showdown
- Multicore Moving
from Embedded to Servers to Clients
- Multicore:
The Early Years
- Modern
Embedded Applications
- Servers
Serve Up Robust Cores
- And Now
Its the PCs Turn
- Multicore
Design Issues
- Program
Support for Multiple Cores
- The Scorecard
So Far
- IDF Fall 2005:
More Cores, Less Power
- Intels
Next Generation Microarchitecture and Revenge of the CISC
- Intels
New Microarchitecture Didnt Surprise
- Intel Next
Generation Based on Yonah
- More Clues
to Power Savings
- Intel to
Take IA-32 Even Lower
- IDF Coverage
Part II
- Intel Shifts
Product Line to Mobile Architecture
- Mobile,
Mobile, and More Mobile
- What Lies
Ahead
- Yonah Does Dual-Core
Right
- More Details
From IDF Fall 2005
- Yonah by
the Numbers
- Core Improvements
- IBMs Double-Shot
of PowerPC
- The Long-Anticipated
Dual-Core PowerPC 970MP Arrives
- POWER4
Microarchitecture Intact
- Playing
Fair With the I/O
- Managing
the Dual-Core Power
- The Power
to Perform
- SPARCs
Still Going Strong
- Fujitsus
New Products Increase Cores, Threads; Suns Niagara Near
- RAS by
Any Other Name
- SPARC Doubles
Down Again in 65nm
- Sun Makes
Its Own Appearance
- Ringside for
2006 Dual-Core Fights
- A Review of
the Dual-core Battles Between AMD and Intel
- Intel Touts
Dual- and Multicore Development
- AMD Slips
Into Silence
- The Action
Begins With Desktop Processors
- Mobile
Processor Featured in Bout Two
- Servers
Featured in the Main Event
- Taking
Score
- Suns Niagara
Begins CMT Flood
- The Sun UltraSPARC
T1 Processor Released
- Niagara
2 Makes the Leap to True SoC
- Some Tuning
Required
- Sun Will
Release Parts of Niagara Design
- Competitors
Take Swipes at Niagara
- When Good
Products Get Bad Marketing
List
of Tables
- Table 1. The candidates
for best PC processor
- Table 2. AMD Opterons
offered with the longevity program
- Table 3. Specifications
for the New Turion 64 processors
- Table 4. Mobile
Athlon 64 vs. Turion 64 ML
- Table 5. Turion
64 vs. Pentium M
- Table 6. This table
provides a broad comparison of multicore embedded processors
- Table 7. Intel
dual-core line-up based on the Banias architecture
- Table 8. IDIV speed
enhancements in Yonah
- Table 9. Average
power values for the PPC 970MP
List
of Figures
- Figure 1. Die photo
of Intel Core Duo processor
- Figure 2. VoIP
subscriber growth
- Figure 3. The Smithfield
(left) and Presler processors generate two bus-interface loads on the
Pentium 4 bus, unlike a single-core processor
- Figure 4. The bus
interface for the dual-core Xeon processor, code-named Paxville, has
an integrated bus interface, limiting the bus loading to one load.
- Figure 5. A dual-processor
system based on the dual-core Dempsey processor will connect to the
Blackford chip set with two independent buses
- Figure 6. The quad-processor
system with the Paxville processor
- Figure 7. Block
diagram and die photo of the Turion 64 processor
- Figure 8. AMD Opteron
840 processor block diagram and die photo
- Figure 9. Intel
Pentium EE block diagram and die photo
- Figure 10. The
various on-chip interconnect strategies
- Figure 11. The
figure on the left shows an example of user-processing demand varying
over time
- Figure 12. Intel
public processor roadmap
- Figure 13. Yonah
die picture from IDF Fall 05
- Figure 14. The
two cores in Yonah can independently change the C1 to C3 power state
- Figure 15. The
PowerPC 970MP microarchitecture remains largely intact but with the
improvement of a larger L2 cache per core
- Figure 16. The
IBM PPC970MP die layout
- Figure 17. Both
of the cores vary voltage and frequency in unison
- Figure 18. For
more-aggressive power savings, IBM has the nap and deeper nap modes
- Figure 19. Fujitsus
latest SPARC64 roadmap. The SPARC64 VI appears to ship in 2H06 and the
SPARC64 VI+ in early 2008
- Figure 20. The
SPARC64 VI processor has extra sets of registers that are used by the
current register window and are backed by the set of two GPR register
blocks
- Figure 21. Introducing
threads allows the processor to continue to scale and can lead to a
gain of up to 20%. This chart shows four threads as the point where
scaling levels off, but while the SPARC64 VI has only two cores, the
model is for a dual-CPU system
- Figure 22. Intels
desktop PC processor roadmap
- Figure 23. Intel
Mobile PC processor roadmap
- Figure 24. Intel
Xeon server-processor roadmap
- Figure 25. Intel
Itanium server-processor roadmap
- Figure 26. The
packaged UltraSPARC T1 processor, formerly code-named Niagara
- Figure 27. The
Niagara 1 block diagram
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