|
|
Home > Communications > Wireless > Components/Equipment
The Development of Camera Phone Module, 2004-2005
|
| Published Date:
March 2005
Published By:
Research in China
Page Count:
124
Order Code:
R687-9
|
|
|
|
- Chapter 1 Composition of camera phone module and the industry chain
- 1.1 Composition and principle concepts
- 1.1.1 Lens
- 1.1.2 Sensor
- 1.1.3 Back-end IC
- 1.1.4 FPC
- 1.2 Assembly technics
- 1.2.1 CSP (Chip Scale Package)
- 1.2.2 COB (Chip on Board)
- 1.3 Cost of the components
- 1.4 Composition of the industry chain
- Chapter 2 Global market and trends
- 2.1 Summary of the global market
- 2.2 Continental markets
- 2.2.1 Asian-Pacific
- 2.2.2 Europe
- 2.2.3 North America
- 2.2.4 Others
- 2.3 Major national and regional market
- 2.3.1 Japan
- 2.3.2 ROK
- 2.3.3 The USA
- 2.3.4 Taiwan of China
- 2.3.5 Others
- 2.4 Trends of the global market
- Chapter 3 Market status quo and trends of China’s camera phone module
- 3.1 Demand and output value
- 3.2 Supply and profits
- 3.3 Technology trends
- 3.4 Market trends
- Chapter 4 Major camera phone module components manufacturers
- 4.1 Lens module manufacturers
- 4.1.1 Summary
- 4.1.2 Taiwan YUJIN
- 4.1.3 Taiwan Largon
- 4.1.4 Taiwan YAGUANG
- 4.1.5 Taiwan JINYUAN
- 4.1.6 Taiwan JINGUOGUANG
- 4.1.7 SANXING DIANJI
- 4.1.8 Sekonix
- 4.1.9 OLYMPUS
- 4.1.10 Cowell World Optech
- 4.1.11 KOLEN
- 4.1.12 Phoenix Optical
- 4.1.13 Other manufacturers
- 4.2 CMOS module manufacturers
- 4.2.1 Summary of CMOS module market
- 4.2.2 CMOS sensor IC design
- 4.2.3 OmniVision
- 4.2.4 Agilent
- 4.2.5 Micron
- 4.2.6 ST semiconductor
- 4.2.7 Hynix?Hyundai?
- 4.2.8 Pixart
- 4.2.9 SANXING DIANJI
- 4.2.10 Taiwan PRIMAX
- 4.2.11 Taiwan PRIXART
- 4.2.12Taiwan TAISHI
- 4.2.13Taiwan YILIN
- 4.2.14 Taiwan DUNLAN
- 4.2.15 TransChip
- 4.2.16 Conexant
- 4.2.17 TOSHIBA
- 4.2.18 SONY
- 4.3 CCD module manufacturers
- 4.3.1 CCD module market summary
- 4.3.2 CCD sensor IC design summary
- 4.3.3 SONY
- 4.3.4 PANASONIC
- 4.3.5 SHARP
- 4.3.6 SANYO
- 4.3.7 TOSHIBA
- 4.3.8 MITSUBISHI
- 4.3.9 FUJI
- 4.3.10 KYOCERA
- 4.3.11 LG Innotek
- 4.3.12 other manufacturers
- 4.4 Back-end IC manufacturers
- 4.4.1 Market summary
- 4.4.2 TI
- 4.4.3 QUALCOMM
- 4.4.4 RENESAS
- 4.4.5 ZTE MICROELECTRONICS
- 4.4.6 ST SEMICONDUCTOR
- 4.4.7 Zoran
- 4.4.8 LINYANG
- 4.4.9 SONGHAN
- 4.4.10 HUABANG
- 4.4.11 Nvidia
- 4.4.12INTEL
- 4.4.13 other manufacturers
- 4.5 FPC manufacturers
- 4.5.1 FPC market summary
- 4.5.2 QISHENG
- 4.5.3 JIALIANYI
- 4.5.4 QIXING
- 4.5.5 YAXING
- 4.5.6WEISHENG TECHNOLOGY
- 4.5.7JIAYI
- 4.5.8HEJUN
- Chapter 5. Camera phone module-assembling companies
- 5.1 Summary of the assembly market
- 5.2 ZHISHEN TECHNOLOGY
- 5.3 PREMIER TAIWAN
- 5.4 QUNGUAN TAIWAN
- 5.5 ZHIJI ELECTRONICS
- 5.6 DUNAN
- 5.6 YANGXIN
- 5.7 SANXING
- 5.8 Cowell World Optech
- 5.9 Sunyang Digital Image
- 5.10 Hansung Elcomtec
- 5.11 Alps Electric
- 5.12 OLYMPUS
- 5.13 Pentax
- 5.14 SHARP
- Chapter 6. Prospects and opportunities
- 6.1 lens module
- 6.2 Sensor
- 6.3 Assembly line
- Chapter 7. Conclusion and Suggestions
|
Similar Products
• The Taiwanese Smart Cellular Device Application IC Market, 3Q 2008
Published Oct 2008 by Market Intelligence Center
• Non-AFIS Fingerprint in Notebook PCs and Wireless Devices Markets
Published Sep 2008 by Frost & Sullivan
• SMobile Systems Private Vendor Watchlist Profile
Published Sep 2008 by IDC
• Wireless Monitoring In Home Healthcare
Published Sep 2008 by Berg Insight
• Mobile Data Modules: Powering the Market for Mobile Internet Peripherals and Devices
Published Sep 2008 by ARCchart
• UK Telecommunications Market Development
Published Sep 2008 by Market and Business Development
• Telecom Equipment Industry
Published Sep 2008 by Global Industry Analysts
• Red Bend: Mobile Software Management for Mobile Operators and Device Manufacturers
Published Aug 2008 by IDC
• Extending PBX Functionalities to Mobile Devices
Published Aug 2008 by Frost & Sullivan
• Wireless Communications Technologies And Solutions
Published Aug 2008 by Mind Commerce Publishing
|
|
|
|
0 items
