Mobile Handset Embedded Memory Development Report, 2005-2006: Industry Research

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Mobile Handset Embedded Memory Development Report, 2005-2006

Published Date: March 2006

Published By: Research in China

Page Count: 184

Order Code: R687-30

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Table of Contents

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1 Overview of handset embedded memory: 1.1 Brief introduction to handset embedded memory; 1.2 Three varieties of PSRAM; 1.3 CellularRAM; 1.4 COSMORAM; 1.5 UtRAM; 1.6 Mobile SDRAM; 1.7 Competition between NOR and NAND; 1.8 Handset micro hard disk and flash memory; 1.9 Development trend of handset memory capacity; 1.10 MCP tariff
2 Handset embedded memory market in China: 2.1 Overview of handset embedded memory market in China; 2.2 Usage analysis of Motorola handset memory; 2.3 Usage analysis of Nokia handset memory; 2.4 Usage analysis of Samsung handset memory; 2.5 Usage analysis of Bird handset memory; 2.6 Usage analysis of SonyEricsson handset memory; 2.7 Usage analysis of Lenovo handset memory; 2.8 Usage analysis of Amoi handset memory; 2.9 Usage analysis of LG handset memory; 2.10 Usage analysis of TCL handset memory; 2.11 Usage analysis of CECT handset memory; 2.12 Usage analysis of other brand handset memory
3 Study on famous manufacturers of handset embedded memory: 3.1 Samsung; 3.2 Intel; 3.3 Spansion; 3.4 STMicroelectronics; 3.5 Micron; 3.6 Toshiba; 3.7 Sharp; 3.8 Elpida; 3.9 Infineon; 3.10 Renesas; 3.11 Hynix; 3.12 NEC; 3.13 Cypress Semiconductor; 3.14 SST; 3.15 Winbond; 3.16 Powerchip Semiconductor; 3.17 ProMOS Technologies; 3.18 Macronix; 3.19 M-System; 3.20 Elite Semiconductor; 3.21 Etron Technology

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