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Home > Communications > Public Switching > Broadband
Wireless Communications in Industrial Automation: Directions
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| Published Date:
September 2006
Published By:
Practel, Inc.
Order Code:
R606-44
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- 1.0 Introduction
- 1.1 General
- 1.2 Value
- 1.3 Ethernet Proliferation
- 1.3.1 Origin
- 1.4 Goals
- 1.5 Research Methodology
- 1.6 Target Audience
- 2.0 Wireless IA Technology Features
- 2.1 Requirements
- 2.1.1 Tasks
- 2.1.2 Wired vs. Wireless
- 2.2 Structures
- 2.2.1 Data Network Topologies
- 2.2.1.1 Point-to-point
- 2.2.1.2 Star
- 2.2.1.3 Mesh
- 2.2.1.3.1 Sensors and Mesh
- 2.2.1.3.2 Example
- 2.2.1.4 Comparison
- 2.3 Security Requirements
- 2.3.1 Details
- 3.0 Standardization Process
- 3.1 General
- 3.2 Layer 2
- 5.0 Choices: Wireless Technologies
- 5.1 Ultra Wideband
- 5.1.1 General
- 5.1.2 Definition
- 5.1.2.1 Rates
- 5.1.3 Spectrum Allocation
- 5.1.3.1 Choices
- 5.1.4 Major Features
- 5.1.4.1 Communications Features
- 5.1.5 Standards and Regulations
- 5.1.5.1 Multiband OFDM
- 5.1.5.2 DS-UWB
- 5.1.5.3 Standards Bodies
- 5.1.5.4 Groups
- 5.1.5.4.1 Forces
- 5.1.6 Methods
- 5.1.7 UWB Vendors
- Aether (localization devices)
- Alereon (chipsets)
- Artimi (chipsets)
- BBN (radio, first responders)
- Camero (radar, equipment for first responders)
- decaWave (chipsets)
- Focus Enhancement (chipsets)
- Freescale (chipsets, systems)
- General Atomics (chipsets)
- Multispectral (RFID and others)
- Parco (RFID)
- Pulse~ Link (chipsets)
- Staccato (chipsets)
- TriQuint (chipsets - homeland security applications)
- Time Domain (chipsets-fusion of communications & radar)
- Tzero (chipsets)
- Ubisense (RFID-tracking)
- Wisair (chipsets)
- WiQuest (chipsets)
- 5.1.8 Market
- 5.1.8.1 General
- 5.1.8.2 Major Segments
- 5.1.8.3 Forecast
- 5.2 ZigBee
- 5.2.1 General
- 5.2.2 Device Types
- 5.2.3 Protocol Stack
- 5.2.3.1 Physical and MAC layers - IEEE802.15.4
- 5.2.3.1.1 Frame
- 5.2.3.2 Upper Layers
- 5.2.4 Interoperability
- 5.2.5 Security
- 5.2.6 Platform Considerations
- 5.2.6.1 Battery Life
- 5.2.7 Technology Benefits and Limitations
- 5.2.8 Standardization Process
- 5.2.8.1 Zigbee Alliance
- 5.2.9 ZigBee Vendors
- Airbee (Software)
- Amber (RF Systems)
- Atmel (Chipsets)
- Chipcon -TI (Chipsets)
- Cirronet (Modules)
- Crossbow(WSN, motes)
- Duolog (Transceivers)
- Eazix (Modules)
- Ember (Chipsets)
- Falcom (Modules)
- Helicomm (Modules)
- Jennic (Chipsets-Modules)
- Freescale (Chipsets)
- Luxoft Labs (Integration)
- M&R Lawugger GmbH (Software)
- Maxstream (WSN Modules)
- Moteiv(Modules, SW)
- Nanotron (Chipsets)
- Oki (Chipsets)
- Renesas (Platforms)
- Silicon Laboratories (Chipsets, Modules)
- Telegesis (Integrator)
- Ubiwave (Mesh Network)
- Uniband (Chipsets)
- ZMD (Chipsets)
- 5.2.10 Market
- 5.2.10.1 Expectations
- 5.2.10.2 Segments
- 5.2.10.3 Forecast
- 5.3 802.11n Technology
- 5.3.1 Advanced Technologies: MIMO and Others
- 5.3.1.1 General
- 5.3.1.2 Spatial Multiplexing
- 5.3.1.3 OFDM
- 5.3.2 Directions
- 5.3.3 Standard
- 5.3.3.1 Ratification
- 5.3.4 Details: Technology
- 5.3.5 Benefits
- 5.3.6 802.11n Vendors
- Atheros
- Belkin
- Broadcom
- Intel
- Ruckus
- Linksys
- Marvell
- Metalink
- Netgear
- SiGe
- 5.3.7 Market
- 5.3.7.1 General
- 5.3.7.2 Market Forecast
- 5.3.7.2.1 Model Assumptions
- 5.3.7.2.1.1 Market Forecast
- 5.3.7.2.1.1.1 Chipsets
- 5.3.7.2.1.1.2 Equipment
- 6.0 WIA Market
- 6.1 Fragmentation
- 6.1.1 Geography
- 6.1.2 Protocols
- 6.1.3 Applications and Industries
- 6.2 Market Drivers
- 6.3 Forecast
- 7.0 IA Wireless: Vendors
- 3eTI (ZigBee)
- Aerocomm
- Cirronet
- Data-Linc
- DataRadio
- Digi
- Dust Networks
- MDS
- Moxa
- Omnex
- ProSoft
- RFM
- Socket
- Tendril
- 8.0 Conclusions
- LIST OF FIGURES
- Figure 1: Ethernet Channel: Simplified Structure
- Figure 2: Ethernet Signal Frame: Basic Structure
- Figure 3: Point-to-point Circuit
- Figure 4: Star Topology Illustration
- Figure 5: Illustration of Mesh Network
- Figure 6: UWB Spectrum
- Figure 7: Market Estimate: UWB Circuitry ($B)
- Figure 8: Market Estimate: Multiband OFDM UWB Circuitry ($B)
- Figure 9: Market Estimate: DS UWB Circuitry ($B)
- Figure 10: Estimate of UWB Market - Communications Applications ($B)
- Figure 11: ZigBee Protocol Stack
- Figure 12: Estimate: ZigBee Chipsets Market Worlwide ($M)
- Figure 13: ZigBee Market Segmentation (2006)
- Figure 14: ZigBee Market Segmentation (2010)
- Figure 15: MIMO Illustration
- Figure 16: 802.11 Protocol Family MAC Frame Structure
- Figure 17: 802.11n IC Market Estimate ($M)
- Figure 18: Market Estimate: 802.11n Equipment Shipping ($B)
- Figure 19: WIA Market Geography
- Figure 20: WIA Market Segmentation: Industries
- Figure 21: WIA Communications Market Estimate ($B)
- LIST OF TABLES
- Table 1: Traditional 802.11 Family
- Table 2: Topologies Comparison
- Table 3: Comparison
- Table 4: UWB Market Segments
- Table 5: Frequency Bands
- Table 6: Rates
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