This report presents a comprehensive analysis of the MOS semi-custom ASIC design market. That is to say, products that are designed and manufactured for a specific customer, to meet a specific system-level requirement, using either the programmable logic, gate array or standard cell design methodologies. While this market had successfully survived prior industry slowdowns, for the most part unscathed, this time around it was affected as much as any other semiconductor product segment. Even though experiencing a revenue decline of over 40% last year, relative to 2000, the market's future remains optimistic, with a return to growth forecast for this year.

End-use consumption for products designed using these design approaches is examined in detail by major end-use, as well as by major second-level end-use applications, such as networks, basestations, servers, medical, et cetera. Geographic consumption for each of the four major regions, The Americas, Europe, Japan and Asia Pacific is also explored, as are operating voltage, packaging and mixed-signal trends. The report further explores, down to the functional level, i.e., major embedded functions, such as SRAM, DRAM, MPU, DSP, PCI, analog, et cetera, that will be included within these designs. The report will also examine the changes in supplier base that have occurred in recent years.